Tystar Doped Anneal


Tystar Doped Anneal (tube 5)

Description

An atmospheric-pressure quartz tube furnace for annealing doped poly-Si and metal-containing wafers. This tool may be used for annealing and glass bonding of wafers containing Al, Cr, and Au, for which there is a maximum allowed temperature of 500 °C.

Features

  • Holds up to 50 100 mm or 150 mm wafers (vertically in quartz boats).
  • Maximum temperature of 1050 °C.
  • For glass bonding, accommodates three 100 mm / 4" × 4" substrates, or two 150 mm / 6" × 6" substrates.


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