Sputtering System #3 (Floyd)

Sputtering System #3 (Floyd)


A load-locked, computer-controlled, planar magnetron sputter system with four sputter guns and RF etch back. Guns 1, 3, and 4 are always loaded with Au, Cr, and Al targets, respectively; Gun 2 is TiW by default, but may be switched to other materials upon request.


  • Four 3" planar magnetron sources
  • Cryo pumped with a base pressure of <1e-7 Torr
  • Automatic operation (via recipes)
  • Load locked with 6 substrates per load
  • Tooling for 150 mm wafers and smaller
  • RF substrate bias (etch back)
  • Rotating substrate holder
  • Typical uniformity of <5% over a 150 mm wafer.