RIE (Oxford NGP80)

RIE (Oxford NGP80)


The Oxford PlasmaPro NGP80 RIE is available to users who require etching or cleaning of materials using standard RIE processes. Standard recipes exist for oxide, nitride, and Si etches, as well as oxygen plasma cleaning and surface activation processes.


  • 300 W RF power supply
  • SiO2, SiN, isotropic Si, polymer etching, surface activation
  • Chemistries: O2, SF6, CHF3, CF4, Ar, N2
  • Plasma etching (PE) mode also available: chamber is biased instead of chuck.