Sputtering System #4 (Moe)


Sputtering System #4 (Moe)

Description

An AJA Orion 8 planar magnetron sputter system with six 2" sputtering guns, four power supplies (2 DC, 2 RF), and substrate heating. It is a load-locked system with manual specimen transfer and automated (computer-controlled) deposition. The targets in all six guns are switched weekly upon request. Metals, dielectrics, and semiconductor materials may be deposited using this system.

Features

  • Six 2" sputtering guns with automated power supply and shutter control
  • QCM for accurate rate testing immediately prior to deposition (not in situ process monitoring)
  • Substrate heating to 500 °C using quartz lamps (higher temperatures may be allowed on a case-by-case basis)
  • RF etchback
  • Plumbed with N2‚ and O2‚ for reactive sputtering
  • Turbo-pumped load lock and process chamber
  • Maximum substrate size: one 100 mm (4") diameter wafer
  • Tooling available for small and irregular pieces
  • Rotating substrate holder


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