Cee 200CB Coat-Bake System #1


Cee 200CB Coat-Bake System #1

Description

Automated spinner/hotplate combo in Primary Litho area for spin-coating and soft-baking photoresist onto 100 mm or 150 mm wafers

Features

  • Spin speed: 0–12 000 RPM
  • Nitrogen proximity and vacuum bake
  • Substrate sizes: 100 mm round, 4" × 4", 150 mm round
  • 100 mm wafer chuck
  • Temperature range: ambient to 300 °C


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