Cee 200CB Coat-Bake System #2


Cee 200CB Coat-Bake System #2

Description

Automated spinner/hotplate combo in Secondary Litho area. Primarily used for photoresist and electron-beam resist coating of specimens 100 mm in diameter and smaller.

Features

  • Spin speed: 0–12 000 RPM
  • Nitrogen proximity and vacuum bake
  • Substrate sizes: <1 cm to 200 mm round
  • Temperature range: ambient to 300 °C
  • 100 mm wafer chuck
  • Universal chuck set for small specimens: base with swappable 1/8", 5/16", 1/2", and 3/4" chucks


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