Cee 200CB Coat-Bake System #2


Cee 200CB Coat-Bake System #2

Description

Automated spinner/hotplate combo in Primary Litho area. Used for photoresist coating/baking of100 mm diameter and 4" × 4" wafers.

Features

  • Spin speed: 0–12 000 RPM
  • Substrate sizes: 100 mm round, 4" × 4"
  • 100 mm wafer chuck only
  • Nitrogen proximity and vacuum bake
  • Temperature range: ambient to 300 °C


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