Disco 3240 Dicing Saw

Dicing Saw (Disco DAD 3240)


The Disco DAD 3240 dicing saw is available for cutting glass, quartz, sapphire, and silicon wafers, or bonded wafer pairs thereof.

N.B. The glass blade is the default blade. If you wish to request a different blade, please follow the procedure outlined in Confluence.


  • Maximum workpiece size: 210 mm diameter