ICPRIE (Alcatel AMS110)

ICPRIE (Alcatel AMS110)


A single-wafer load-locked DRIE system for deep etching of Si (Bosch) or glass substrates. Only photoresist or oxide may be used for etch masks (i.e., wafers cannot contain any exposed metal).


  • Si, SiO2, quartz, and Pyrex etch capability
  • C4F8, SF6, He, Ar, O2, CH4 chemistries
  • 3:1 oxide:resist selectivity for oxide etching
  • 25:1 Si:resist selectivity for Bosch etching