ICPRIE (Alcatel AMS110)


ICPRIE (Alcatel AMS110)

Description

A single-wafer load-locked DRIE system for deep etching of Si (Bosch) or glass substrates. Only photoresist or oxide may be used for etch masks (i.e., wafers cannot contain any exposed metal).

Features

  • Si, SiO₂, quartz, and pyrex etch capability
  • C₄F₈, SF₆, He, Ar, O₂, CH₄ chemistries
  • 3:1 resist:oxide selectivity for oxide etching
  • 25:1 resist:Si selectivity for Bosch etching


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