Mask Aligner (IR through-wafer) (Bert – MA#1)


Mask Aligner (IR through-wafer) (Bert - MA#3)

Description

Standard contact mode mask aligner with CCD alignment system & IR backside alignment capability.

Features

  • IR through-wafer imaging for backside alignment (4" diameter wafers with 5" × 5" photomasks only)
  • Tooling: 3", 4", and 6" diameter wafers, 4" × 4" square substrates, and small pieces
  • Mask tooling: 5" × 5" or 7" × 7" square photomasks
  • UV illumination (365 nm & 405 nm)


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