Articles & News

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Stealth Dicing: Now at the nanoFAB!

Stealth dicing of Si wafers is now available as a service at the nanoFAB

Breanna Cherkawski
2026-05-07
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Field alignment now available on the Heidelberg MLA150

Improve your DWL alignment precision with new field alignment capability

Gustavo de Oliveira Luiz
2025-10-23
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Heidelberg MLA150
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nanoFAB Unveils Cleanroom Expansion

The University of Alberta nanoFAB Centre is proud to announce the successful completion of its cleanroom expansion.

nanoFAB
2025-06-30
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New Die Matrix Expander Available

Improve your dicing post-processing with our new die matrix expander

Breanna Cherkawski
2024-10-30
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Diced silicon wafer on a die matrix expander tool
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Optical Emission Interferometry (OEI) in the Plasma-Therm Versaline PECVD

Using endpoint detection in PECVD recipes to improve film thickness accuracy

Timothy Harrison
2024-09-03
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Graph titled "Endpoint Data" shows an oscillating white line with red and green highlights, likely depicting Optical Emission Interferometry data. The X-axis is time and the Y-axis is smoothed data. A red notation reads "T = λ/(2n)" with a horizontal bracket, possibly showcasing Plasma-Therm analysis.
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AML Wafer Bonder now available for training

Advanced wafer bonding capabilities are now available using the AML AWB-04

Scott Munro
2024-03-28
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