The nanoFAB is pleased to post the following opportunity at University of Windsor.
The details of the position, including responsibilities, qualifications, experience, and education are listed in the following link: Postdoctoral Position – NEMS-MEMS Inertial Sensor Fabrication
The nanoFAB is pleased to announce the installation of a multi-mode Optical Profilometer from Keyence. The Keyence VK-X3050 is a red laser scanning confocal system equipped with confocal, white light interferometry (WLI), and focus variation metrology modes. The tool natively offers wide-area scanning through stitching modes. Feature-aligned, repetitive, and correlative multi-objective multi-mode measurements are enabled through user-defined Teaching modes.
The three analysis modes support a scaled level of resolution and accuracy. Users can combine any of the three modes to support analysis needs down to 1nm Z-resolution in Confocal and Focus Variation modes, and 0.01nm Z-resolution in WLI mode.
The system is equipped with a high-resolution 16-bit photomultiplier that enables deep feature extraction of hard-to-analyze features such as 1µm Silicon vias. The system has demonstrated 30µm of depth resolution in narrow/confined grooves in some applications. Leveraging the high-resolution measurement capability, the automated XY stage (100mm x 100mm) allows for larger-scale analysis using single or multiple objectives. The automated measurement allows for stitching of large area samples with spatially separate or continuous features. Beyond the profilometry capabilities, optical observation can be supported, coupled, and enhanced by the laser observation modes, enabling transparent feature on transparent substrate imaging.
In cases where Confocal microscopy fails to resolve features, the WLI mode acts not only as a complement but also as an enhancement. The WLI mode allows users to level samples through intelligent tip-tilt alignment with guided steps to achieve high-resolution measurements. The resulting files can be analyzed in the same browser as the laser confocal modes and are easily tracked by utilizing the built-in measurement metadata.
The system features a built-in sample mapping mode that supports any objective and allows mapping in laser and optical observation modes. Defect inspection is achievable through this feature mapping by ring-light illumination, allowing for highlighting of defect locations. The Coaxial/Ring light modes are supported by a Focus Variation Profilometry technique, enabling fast measurement of millimeter-scale features of bulk metals, coins, and machined parts. Any of the three modes, techniques, or setups can be further enhanced by the Teaching Measurement mode. Teaching Measurement modes allow for multi-mode, multi-objective, multi-site analysis that can be feature aligned across multiple runs or iterations performed today, or tomorrow.
The details of the positions, including responsibilities, qualifications, experience, and education are listed in the following links:
Postdoctoral Research Intern – Microwave Hardware Design (Mitacs/NSERC Project)
The Heidelberg MLA150, our direct-write laser lithography system, is known for its outstanding performance when aligning a new design to a patterned wafer. Nominally the system is capable of better than ±500 nm global alignment precision in both X- and Y-directions (for topside, ±1 μm for backside), typically surpassing that and producing results in the ±300 nm range. However, depending on factors such as stress build-up on wafers due to deposited materials, this precision may become compromised and produce both worse alignment overall as well as non-uniform precision (i.e., varying die-to-die alignment precision).
To overcome the limitations caused by using a single, global alignment for a whole wafer, we now have the option to perform local alignment on each die. This new method, as evidenced by the image below, greatly improves alignment precision on each die, reducing both the overall offset and the die-to-die variation. In this demo, standard alignment (left) shows offsets in the ±300 nm range. While all dies are within specification, the offset still varies by up to 500 nm die-to-die. On the other hand, field alignment (right) greatly improves the results, such that all dies exhibit offsets in the ±50 nm range (i.e., the resolution of the verniers used for this test).
This improved precision does come at the cost of longer exposure times, however, since the system now has to scan and measure alignment marks for each die being patterned. However, this is a reasonable cost to pay when poor alignment is detrimental to device performance. Please note that this new technique is only available for topside alignment—it cannot be used for backside alignment due to the requirements for this procedure.
If you are interested in using this new field alignment feature, a new document detailing the procedure is available by the tool, and in our Knowledge Base. Also, please do not hesitate in submitting a training request via LMACS if you wish to get hands-on training. For more information, please contact Gustavo de Oliveira.
The nanoFAB has completed a large cleanroom expansion, marking a significant milestone in our 25-year history. This expansion represents a strategic investment in supporting the commercial and academic growth of semiconductor manufacturing and materials characterization at the nanoFAB. Through this expansion we are firmly establishing our role as a regional and national contributor to academic and commercial technology developments.
The nanoFAB is an open-access centre specializing in academic research and industry development in micro/nano fabrication and characterization. We provide training and access to over $100M in advanced state-of-the-art equipment and infrastructure to support hundreds of academic and industrial groups across Canada.
This critical infrastructure upgrade is set to deliver substantial benefits:
Enhanced Capabilities and Capacity: The expansion directly addresses increased demand for industry hiring and growth, constrained by the lack of space for manufacturing activities. This new cleanroom space will allow for the installation of new equipment, enable hiring of new industrial employees, and create enhanced training opportunities for post-secondary students—boosting productivity, while filling capability gaps that will facilitate industry scale-up and research innovation activities in semiconductor device fabrication.
Driving Economic Diversification: The nanoFAB plays a vital role in fostering economic diversification and entrepreneurship, through providing access state-of-the-art capabilities allowing for technology development. This expansion will further support the development of high-value semiconductor manufacturing, particularly in areas such as energy, advanced electronics, sensing, and quantum systems. It aligns with our goal of strengthening innovation in Alberta and Canada by supporting a critical and growing mass of R&D activities.
Training the Next Generation of Talent: The nanoFAB is a crucial training ground for in-demand talent with hands-on experience in semiconductor manufacturing and materials characterization. This expansion will continue to support the development of highly skilled engineers, scientists, and technicians. The skills developed at the nanoFAB support a growing industry that contributes to economic diversification and the expansion of high-value manufacturing in Canada.
Strengthening Research and Innovation: The expanded cleanroom aligns with our strategic goals of attracting and retaining talent, developing open-access, sustainable infrastructure, and being able to support the growth of research, teaching, and commercialization activities within the University of Alberta. It also supports our broader goals of building a resilient local technology ecosystem that supports the scale-up of innovative hardware manufacturing capabilities.
Our cleanroom expansion, coupled with our ongoing support from industry partners and provincial and federal governments, underscores our strong commitment to being a catalyst for translating laboratory discoveries into high-value commercial outcomes, driving innovation and economic prosperity for Alberta and Canada.
For enquiries regarding this expansion, please contact nanofab@ualberta.ca.
The nanoFAB is pleased to post the following two Front End Process Engineer career opportunities at Hyperlume.
The details of the positions, including responsibilities, qualifications, experience, and education are listed in the following links: