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Wet Chemical Processing

Comprehensive wet chemical processing area with dedicated wet decks for substrate cleaning and surface preparation, etching (metals, dielectrics, semiconductors), and general solvent processing.

General-use wet decks

  • Four general-use exhausted wet decks available for varied processing
  • Solvent processing, metal etching, and HF/BOE etching
  • Equipped with dump rinsers, solvent waste, DI water and N₂ guns
A person wearing gloves rinses a circular silicon wafer with a spray bottle, over a white perforated surface.

KOH/TMAH etching

  • Dedicated deck for anisotropic etching of Si (KOH and TMAH)
  • Four heated, recirculated chemical baths for various wafer and batch sizes
A gloved hand lifts a container holding circular silicon wafers from a white, perforated surface in a clean room setting.

Lithography processing

  • Solvent-processing fume hoods for lithography spin-coating, soft-baking, and related applications
  • Dedicated stations for processing photoresists, EBL resists, and other organic coatings