Career opportunity - icspi

The nanoFAB is pleased to announce the following three positions at iscpi.

• Semiconductor Packaging Engineer - Own the packaging solution for MEMS devices from concept to qualification (dicing, die attach, interconnect). Mostly supplier engagement, some cleanroom.
• Semiconductor Microfabrication Engineer - Build the fabrication processes for our MEMS devices and AFM probe tips, from concept through qualification. Mix of cleanroom and supplier work.
• R&D Application Engineer -  Develop characterization protocols for customer samples and push AFM hardware to its limits through novel drive methods, calibration, and data analysis.

For more information about these listings and other job openings, please visit www.icspicorp.com/careers.

About icspi

icspi is building the future of nanoscale imaging.

We’ve revolutionized atomic force microscopy (AFM) by miniaturizing it by a factor of 1,000,000× compared to traditional systems: integrating all the components of an AFM onto a single CMOS chip, which we call microAFM.

Our core tech is field-proven and powers our desktop instruments that are used by scientists and engineers in over 40 countries.

Now we are using our core tech to solve throughput-resolution gaps in the semiconductor industry: catching nanoscale defects to enable new processes and prolong Moore's Law.

Today, scanning a wafer with AFM would take about 70 years. By using thousands of microAFMs in parallel, we can scan a wafer in a matter of hours.

Build the future of nanoscale imaging with us.

Learn more at: www.icspicorp.com