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Advanced Lithography

Precise micro- and nanoscale patterning is available through our suite of lithography tools, including electron-beam lithography (EBL), direct-write (maskless) laser lithography, two-photon polymerisation 3D printing, and conventional contact mask aligners.

Direct-write laser lithography

  • Heidelberg MLA150 maskless aligner
  • Expose wafers directly from GDSII pattern file:  no need for a photomask
  • Automated topside and backside alignment
  • 405 nm / 375 nm exposure
  • High-aspect-ratio mode and greyscale lithography
A device uses a blue laser to scan intricate microchip patterns on a silicon wafer. Four red arrows point to the wafer's surface.

Electron Beam Lithography

  • RAITH Voyager (50 kV) and RAITH150 Two (0.2–30 kV) EBL systems
  • Interferometric laser stage for stitching
  • <10 nm minimum feature size
  • FBMS/MBMS mode enables full-wafer, stitch-free processing
Close-up of the loading lock on the Raith VOYAGER electron beam lithography (EBL) system at the University of Alberta nanoFAB, enabling high-precision nanofabrication and semiconductor research.

Nanoscale 3D Printing

  • Two-photon polymerization process for microscale 3D printing
  • Submicron feature sizes in all 3 axes
  • Dynamic precision printing modes for a wide range of applications
Scientist analyzing a 3D model on a computer screen in a lab environment.

Contact photolithography 

  • General-purpose UV exposures
  • H-line (405 nm) / I-line (365 nm)
  • IR/optical backside alignment
  • Deep-UV exposures (220 nm / 254 nm)
  • Semi-automated alignment
  • Positive/negative tone resist chemistries
Close-up of a flatbed scanner with the lid open, showing the glass surface and part of the scanner's frame.

In-house photomask fabrication 

  • Heidelberg DWL200 pattern generator
  • Produces 5" & 7" photomasks
  • 1 µm minimum feature size
  • Full-service processing with online mask submission
Close-up of a high-resolution photomask used in advanced lithography at the University of Alberta nanoFAB, showcasing intricate patterns for semiconductor manufacturing and microfabrication.