Our Equipment
- Alpha-Step IQ
- Alpha-Step IQ - 10k
- Atomic Force Microscope (Asylum MFP-3D AFM)
- Atomic Force Microscope (Dimension Edge)
- Auger Microprobe (JAMP-9500F, JEOL)
- Autosorb iQ
- Autosorb Quantachrome 1MP
- Branson 3000 Barrel Etcher
- Brewer Spinner and Hotplate
- Bruker XRD D8 Discover
- Cee 200CB Coat-Bake System #1
- Cee 200CB Coat-Bake System #2
- Cold plate (Stir-Kool SK-12D)
- Contact Angle (FTA-200)
- Critical Point Dryer
- Denton Gold Sputter Unit (for SEM)
- Dicing Saw (Disco DAD 321)
- Differential Scanning Calorimeter (DSC)
- Disco 3240 Dicing Saw
- Discovery TGA
- Electron Beam Evaporation System #1 (Gomez)
- Ellipsometer (M-2000V)
- Eppendorf Centrifuge 5804R
- Filmetrics Resist and Dielectric Thickness Mapping System
- Filmetrics Thickness Monitor (F10-VC) (A)
- Filmetrics Thickness Monitor (F10-VC) (B)
- Flexus Wafer Stress Measurement System
- Four Point Probe
- Four Point Probe (Pro4 4000) (A)
- Four Point Probe (Pro4 4000) (B)
- FTIR (Nicolet 8700)
- FTIR-iS50
- Fumehood (Aisle 1 - Headway Spinner/Hotplate)
- Fumehood (Aisle 2 - KOH/TMAH)(Station A)
- Fumehood (Aisle 3 - General Use)
- GLAD System #1 (Dagda)
- GLAD System #2 (Achilles)
- Glass Bonding Area
- Helium Ion Microscope (Zeiss Orion NanoFAB with Ga FIB)
- ICPRIE - Oxford Estrelas
- ICPRIE (Alcatel AMS110)
- ICPRIE (Cobra Metal Etch)
- Industrial L-Edit
- Inpsection Microscope (Leitz Ergolux in 10K lab)
- Inspection Microscope (Leica MS5 in 10K lab)
- Inspection Microscope (Leitz Ergolux in 1K lab)
- Keithley 4200-Semiconductor Characterization System (SCS Analyzer)
- LEDIT on two computer systems
- Leica ACE600 Carbon/Metal coater
- Leica INM 100 Optical Microscope
- Leica INM-100 Optical Microscope
- Litho Wetdeck #1
- Litho Wetdeck #2
- Lithography Process Station 1
- Lithography Process Station 2
- LPCVD Boron Doped PolySi Deposition
- LPCVD Nitride Deposition
- LPCVD PolySi Deposition
- Mask Aligner (Grover - MA#1)
- Mask Aligner (IR through-wafer) (Bert - MA#1)
- Mask Cleaning Station
- Mask/Bond Aligner (SUSS MA/BA6)
- Micromanipulator
- Minibrute Bottom Furnace (Boron Doping)
- Minibrute Middle Furnace (Thermal Oxide and General Annealing)
- Minibrute Top Furnace (Thermal oxide and General annealing)
- Muffle Furnace
- Muffle Furnace (For PZT only!)
- NanoIndenter (Hysitron TI 900)
- Nanometrics Hall Measurement (HL5500)
- NanoWizard II AFM (JPK)
- Olympus Laser Confocal Microscope (OLS3000)
- Orbis PC Micro-EDXRF Elemental Analyzer
- Parylene Deposition System
- Pattern Generator (Heidelberg DWL-200)
- Pattern Generator Compile software on one computer system
- PDMS Process area
- PECVD (Trion)
- Photomask Processing Station
- Probe Station #1 (Wentworth)
- Probe Station #2 (Wentworth)
- Profilometer (Tencor P-6)
- Raith EBL software on two computer systems
- RAITH150 Two EBL System
- RIE (Oxford NGP80)
- RIE (Trion)
- RIE (uEtch)
- Rigaku XRD Ultima IV
- Savant SuperModulyo Freeze Dryer
- Scanning Electron Microscope (Tescan Vega-3 w/ EDX)
- Scanning Electron Microscope (Zeiss EVO MA10)
- Scanning Electron Microscope (Zeiss Sigma FESEM w/ EDX & EBSD)
- Scriber
- Servo Precision Drill Press (7140-M)
- Solitec Spinner and Vacuum Hotplate
- Spectrophotometer (Perkin-Elmer NIR-UV)
- Spectrophotometer UV/VIS (Hitachi U-3900H)
- Speedvac Concentrator
- Spin Rinse Dryer (Wet aisle #1)
- Spin Rinse Dryer (Wet aisle #2)
- Sputtering System #1 (Bob)
- Sputtering System #2 (Doug)
- Sputtering System #3 (Floyd)
- SUSS Bonder
- Teflon AF Processing
- Thermal Gravimetric Analyzer (TGA)
- Thin Film Stress Measurement (FLX 2320)
- TOF-SIMS Imaging Spectrometer (ION-TOF GmbH)
- Tystar Doped Anneal
- Tystar General Anneal
- Tystar Oxidation
- Upright Microscope (LV150)
- UV / Ozone Bonder
- UV Flood Exposure System (Sunny)
- UV/VIS Spectrophotometer (U-3900H)
- UV/VIS Spectrophotometer (U-3900H)
- Vacuum Ovens (×3)
- Vapour HF Etcher (memsstar Orbis Alpha)
- VASE Ellipsometer
- Wet Process - General Use - DD Aisle#1
- Wet Process - General Use - DD Aisle#2
- Wet Process - General Use - WD Aisle#1
- Wet Process - HF/BOE - DD Aisle#1
- Wet Process - HF/BOE - DD Aisle#2
- Wet Process - Metal Etch - DD Aisle#1
- Wet Process - Metal Etch - DD Aisle#2
- Wet Process - Metal Etch - WD Aisle#1
- Wet Process - Piranha - WD Aisle#2
- XeF2 Etching System
- XPS Imaging Spectrometer (Kratos AXIS Ultra)
- XPS Spectrometer (Kratos AXIS 165)
- Yamato Oven
- YES HMDS Oven
- Zeiss AXIO lab A1 Optical Microscope
- Zeiss Stemi508 Stereo Microscope
- Zygo Optical Profilometer
Autosorb Quantachrome 1MP
Description
Allows for determination of surface area and pore size of materials through gas adsorption analysis based on B.E.T Theory. The Autosorb 1MP surface area analyzer is optimized for micropore analysis and capable of high vacuum, low pressure, and chemisorption measurements.Features
- 5 pressure transducers covering the range from 0–1000 Torr
- Adsorbates available; N₂ and He for low surface area analysis
- Pore Size Range: 3.5 to >5000 Å / 0.35 to >500 nm
- Surface Area Range: 1 m²/g to no known upper limit (nitrogen)
