Our Oxford Instruments Cobra ICPRIE tool is now online and available for user training. Primarily intended for etching metals using chlorine-based chemistries, this flexible, load-locked plasma etcher is plumbed with Ar, O₂, SF₆, CHF₃, Cl₂, BCl₃, and HBr, enabling highly anisotropic etching of a wide variety of materials. Recipes currently exist for etching chromium, gold, and silicon, with process support for other materials available upon request.
Features include:
- Non-toxic gases: Ar, O₂, SF₆, CHF₃
- Toxic gases: Cl₂, BCl₃, HBr
- Continuous quartz clamping with He backside cooling
- 100 mm & 150 mm wafer handling available
- 5 kW ICP generator
- LN2 Cooling with high-temperature platen (–110 °C to +400 °C)
- Single-wafer load lock
For more information, please contact Aaron Hryciw. Any nanoFAB users wishing to use this tool should submit a training request via LMACS.
Cross-sectional SEM image of a 5 µm via etched through 200 nm Cr on a thermal oxide substrate.
