For more information, please contact Aaron Hryciw. Any nanoFAB users wishing to use this tool should submit a training request via LMACS. Please note that this tool is currently restricted to processing with full wafers only (100 mm or 150 mm), and access will be approved on a case-by-case basis, according to technical need.
SUSS MA/BA6 mask/bond aligner
on October 15, 2016
The nanoFAB is pleased to announce that our recently installed SUSS MicroTec MA/BA6 Gen3 mask/bond aligner is now available for user training. This tool can accommodate substrates up to 150 mm in diameter, and is equipped with automatic mask-to-wafer alignment (using image processing and pattern recognition) and backside optical alignment (using stored images). With easy changeover from mask to bond aligner mode, the MA/BA6 can also be used to align 100 mm wafers for bonding, in conjunction with our SUSS Bonder.