SUSS MA/BA6 mask/bond aligner

The nanoFAB is pleased to announce that our recently installed SUSS MicroTec MA/BA6 Gen3 mask/bond aligner is now available for user training. This tool can accommodate substrates up to 150 mm in diameter, and is equipped with automatic mask-to-wafer alignment (using image processing and pattern recognition) and backside optical alignment (using stored images). With easy changeover from mask to bond aligner mode, the MA/BA6 can also be used to align 100 mm wafers for bonding, in conjunction with our SUSS Bonder.

For more information, please contact Aaron Hryciw. Any nanoFAB users wishing to use this tool should submit a training request via LMACS. Please note that this tool is currently restricted to processing with full wafers only (100 mm or 150 mm), and access will be approved on a case-by-case basis, according to technical need.

hpr504-prox-1-75um 1.75 µm features in HPR504, exposed using a 20 µm proximity gap

hpr504-vac-0-7um 0.70 µm features in HPR504, exposed in vacuum contact mode