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- Capabilities
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- Alpha-Step IQ
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- Cee 200CB Coat-Bake System #1
- Cee 200CB Coat-Bake System #2
- Cold plate (Stir-Kool SK-12D)
- Contact Angle (FTA-200)
- Critical Point Dryer
- Denton Gold Sputter Unit (for SEM)
- Dicing Saw (Disco DAD 321)
- Disco 3240 Dicing Saw
- Dymax BlueWave 200
- Electron Beam Evaporation System #1 (Gomez)
- Electron-Beam Evaporation System #2 (PVD-75)
- Ellipsometer (M-2000V)
- Filmetrics F50-UV
- Filmetrics Thickness Monitor (F10-VC) (B)
- Four-Point Probe
- Four-Point Probe (Pro4 4000)
- FTIR-iS50
- Fumehood (Aisle 1 – Laurell / Headway Spinner/Hotplate)
- Fumehood (Aisle 2 – KOH/TMAH)(Station A)
- Fumehood (Aisle 3 – General Use)
- GLAD System (Achilles)
- Glass Bonding Area
- Heidelberg MLA150
- Helium Ion Microscope (Zeiss Orion NanoFAB with Ga FIB)
- ICPRIE (Alcatel AMS110)
- ICPRIE (Cobra Metal Etch)
- ICPRIE (Oxford Estrelas)
- Keithley 4200-Semiconductor Characterization System (SCS Analyzer)
- Leica ACE600 Carbon/Metal coater
- Leica INM-100 Optical Microscope #1
- Leica INM-100 Optical Microscope #2
- Litho Wet Deck #1
- Litho Wet Deck #2
- LPCVD Boron Doped PolySi Deposition
- LPCVD Nitride Deposition
- LPCVD PolySi Deposition
- Mask Aligner (Grover – MA#1)
- Mask Aligner (IR through-wafer) (Bert – MA#1)
- Mask/Bond Aligner (SUSS MA/BA6)
- Minibrute Bottom Furnace (Boron Doping)
- Minibrute Middle Furnace (Thermal Oxide and General Annealing)
- Minibrute Top Furnace (Thermal oxide only)
- Muffle Furnace
- Muffle Furnace (For PZT only!)
- Nanometrics Hall Measurement (HL5500)
- Nanoscribe Photonic Professional GT
- Olympus Laser Confocal Microscope (OLS3000)
- Parylene Deposition System
- Pattern Generator (Heidelberg DWL-200)
- PDMS Process area
- PECVD (Trion)
- Probe Station #1 (Wentworth)
- Probe Station #2 (Wentworth)
- RAITH150 Two EBL System
- RIE (Oxford NGP80)
- RIE (Trion)
- RIE (uEtch)
- Rigaku XRD Ultima IV
- Savant SuperModulyo Freeze Dryer
- Scanning Electron Microscope (Zeiss EVO MA10)
- Scanning Electron Microscope (Zeiss Sigma FESEM w/ EDX & EBSD)
- Scriber
- Servo Precision Drill Press (7140-M)
- Sitek SRD (bottom – 100 mm)
- Sitek SRD (top – 150 mm)
- Spectrophotometer (Perkin-Elmer NIR-UV)
- Spectrophotometer UV/VIS (Hitachi U-3900H)
- Spin Rinse Dryer (Wet aisle #1)
- Sputtering System #1 (Bob)
- Sputtering System #2 (Doug)
- Sputtering System #3 (Floyd)
- Sputtering System #4 (Moe)
- SUSS Bonder
- Thin Film Stress Measurement (FLX 2320)
- TPT HB16 Wire bonder
- Tystar Doped Anneal
- Tystar General Anneal
- Tystar Oxidation
- Upright Microscope (LV150)
- UV / Ozone Bonder
- UV Flood Exposure System (Sunny)
- Vacuum Ovens (×3)
- Vapour HF Etcher (memsstar Orbis Alpha)
- VASE Ellipsometer
- Wet Process – General Use – Wet Deck 1A
- Wet Process – General Use – Wet Deck 1B
- Wet Process – General Use – Wet Deck 2A
- Wet Process – HF/BOE – Wet Deck 1A
- Wet Process – HF/BOE – Wet Deck 1B
- Wet Process – ISE KOH Bath – Wet Deck 2A
- Wet Process – Metal Etch – Wet Deck 1A
- Wet Process – Metal Etch – Wet Deck 1B
- Wet Process – Piranha – Wet Deck 2B
- XeF2 Etching System
- XPS Imaging Spectrometer (Kratos AXIS Ultra)
- Yamato Oven
- YES HMDS Oven
- Zeiss AXIO Lab.A1 (east plasma area)
- Zeiss AXIO Lab.A1 (W1-040)
- Zeiss AXIO Lab.A1 (west plasma area)
- Zeiss Stemi 508 (east plasma area)
- Zeiss Stemi 508 (W1-040)
- Zygo Optical Profilometer
- Resource Library
- Chemical Import Form
- Facility Conditions
- FACS Flow Cytometer
- General Information
- Glossary
- Gold Plating Solution
- Help with Downloading a Resource
- Help with Uploading a File
- Home
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- Mask Aligner (Oscar – MA#1)
- nanoFAB News
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- No Access
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- Sample Full Width
- Services
- Electron-beam lithography service
- Fee for Service – Fabrication
- Fee for Service – Characterization/Sample Analysis
- Mask Fabrication
- Resale Items
- AQM SiOx resist kit
- Carrier – 4″ Round Wafer Carrier Box (25pcs)
- Carrier – 4″ Single Wafer Carrier (Round)
- Carrier – 4″ Square or Round Carrier
- Carrier – 5″ Photomask Holder (1pc)
- Carrier – 6″ Single Wafer Carrier (Round)
- Cleanroom Notebook (small)
- Cleanroom Paper (pk of 250)
- Crucible Liner – Fabmate
- Crucible Liner – Graphite
- Electra 92
- Gel Pak (Large)
- Gel Pak (Mini)
- Gel Pak (Small)
- Grip Ring – 4″
- Grip Ring – 6″
- Microscope Slides
- PDMS Kit
- Petri Dish – Large
- Petri Dish – Small
- Petri Dish – Small with 4 Compartments
- Precious Metal – Bob – Au
- Precious Metal – Bob – Pd
- Precious Metal – Bob – Pt
- Precious Metal – Doug – Au
- Precious Metal – Doug – Pd
- Precious Metal – Doug – Pt
- Precious Metal – e-beam – Au
- Precious Metal – e-beam – Pd
- Precious Metal – e-beam – Pt
- Precious Metal – Floyd – Au
- SEM – Carbon Conductive Tabs (1 sheet of 25)
- SEM – Sample Box (Large)
- SEM – Sample Box (Medium)
- SEM – Sample Box (Small)
- SEM – Stubs – Al Specimen Mounts (Each)
- Substrate – 100 mm Si prime wafer
- Substrate – 100 mm Si test grade wafer
- Substrate – 100 mm Si with ~0.5 µm thermal oxide
- Substrate – 150 mm Si prime wafer
- Substrate – 4″ Fused Silica Round (7980 Quartz w/flat)
- Substrate – 4″ Glass – 0211 Square
- Substrate – 4″ Glass – Borofloat Round
- Substrate – 4″ Glass – Borofloat Square
- Substrate – 4″ Pyrex round – double sided with flat (No Wet-etch)
- Substrate – 5″ Glass – Sodalime Square
- User Training
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- Camera: Dicing
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- Camera: Embossing
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- Camera: LPCVD Gas Cabinet
- Camera: Plasma Etching
- Camera: Plasma Etching / LPCVD
- Camera: Raith-II
- Camera: Sputtering
- Camera: Wet Aisle 1
- Camera: Wet Aisle 2
- Camera: Wire Bonding / Electroplating
- Inspection Area Map
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- Plasma Area Map
- Sputtering & Deposition Area Map
- Wet Processing Area Map
- Submit Maintenance / Concern Form
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- View The Cleanroom
Categories:
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Authors:
- Aaron Hryciw (64)
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- Bob Brebber (2)
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- Dr. Eric Flaim (62)
- Gustavo de Oliveira Luiz (5)
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- Keith Franklin (131)
- Melissa Hawrelechko (30)
- Michael Hume (13)
- Nancy Zhang (1)
- Nastaran Yousefi (1)
- Peng Li (41)
- Scott Munro (5)
- Shiau-Yin Wu (1)
- Timothy Harrison (1)
- Xuehai Tan (3)
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Recent Posts:
- AML Wafer Bonder now available for training
- New Spray Coating Tool Available
- Career Opportunity – Preciseley Microtechnology Corp.
- Advanced TEM Sample Preparation
- SAXS, GI-SAXS/WAXS are available on Bruker D8D+
- Career Opportunity – Sonus Microsystems
- Career Opportunity – Avalon Holographics
- Career Opportunity – ColdChase
- Raith_GDSII toolbox documentation now on Read The Docs
- Career Opportunity – NRC Canada
- Career Opportunity – Interface Fluidics
- Career Opportunity – Applied Quantum Materials
- Career Opportunity – Sheba Microsystems
- Broad Ion Beam (BIB) polishing for SEM/EDX/EBSD
- Career Opportunity – nanoFAB
- nGauge AFM is now Available at nanoFAB
- Career Opportunity – Norcada Inc.
- Career Opportunity – Norcada Inc.
- In-situ heating S/TEM is available
- Bruker D8D plus XRD-SAXS is Operational
- New nanoFAB Characterization Staff
- Auto Slice&View (ASV) fully commissioned
- New nanoFAB Characterization Staff
- Career Opportunity – Applied Nanotools Inc. (ANT)
- Career Opportunity – Norcada Inc.
- XPS analysis of air-sensitive materials
- Kurt J. Lesker 150LX ALD system now open for training
- Career Opportunities – Norcada Inc.
- The nanoFAB is hiring
- Career Opportunity – Applied Nanotools Inc. (ANT)
- Plasma-Therm Versaline PECVD now available
- Spin Mill with Plasma FIB
- Summer 2022 Newsletter
- New nanoFAB Characterization Staff
- Career Oppontunity – Avalon Holographics
- Career Opportunity – Sheba Microsystems
- New nanoFAB fabrication staff
- Structure zone model calculator
- Spring 2022 Newsletter
- Stephanie Retirement Announcement
- Lithography area upgrade
- 4D X-Ray Microscopy is Available.
- Choose the right techniques for multi-layer film analysis
- Career Opportunities – Norcada Inc.
- Career Opportunities – Norcada Inc.
- Career Opportunities – Norcada Inc.
- Winter 2022 Newsletter
- New positive-tone EBL resist in stock: CSAR 62 (AR-P 6200)
- Hitachi S4800 FESEM is Available
- nanoFAB Winter 2021 Shutdown Schedule
- Multilevel deep etching in silicon
- Multi-Ion Beam FIB/SEM is Operational
- Fall 2021 Newsletter
- Career Opportunities – Avalon Holographics
- Career Opportunities – TransEON
- Career Opportunities – Norcada Inc.
- Advanced XPS Capabilities Are Available
- X-Ray Microscopy/nanoCT is Available
- Career Opportunity: Dream Photonics – photonic packaging technician
- Career Opportunity – Teledyne/Micralyne Project Manager & Process Eng/Sci
- Canada Day Holiday Closure – July 1, 2021
- Spring 2021 Newsletter
- Career Opportunity – The National Research Council of Canada (NRC) Postdoctoral Fellow
- Career Opportunity – G2V Optics Applications Scientist
- Career Opportunity – Norcada MEMS Process Technologies
- Career Opportunity – Quantium Technologies Sr. Research Professional
- Career Opportunity – Bio-Stream Electrical Engineer
- Career Opportunity – SmileSonica Summer Student
- Invited speaker at U of T – Nanoscribe demo
- Confocal Raman Microscopy now available to users
- Career Opportunity – Teledyne Project Manager
- Winter 2021 Newsletter
- PVD-75 e-beam evaporation system now open for training
- nanoFAB Evaluation Survey
- Career Opportunity – Lead Microfabrication Process Engineer ICSPI (Waterloo)
- Career Opportunity – Postdoctoral position at theStewart Blusson Quantum Matter Institute at UBC
- 2020 Image Contest Winners!
- nanoFAB Winter 2020 Shutdown Schedule
- 2020 nanoFAB image contest
- Career opportunity: Avalon Holographics
- Career opportunity: Anyon Systems
- Fall 2020 Newsletter
- Transmission EBSD is Available.
- TPT HB16 Wire bonder now available to users
- Operational Update
- Summer 2020 Newsletter
- FTIR Microscopy is Operational and Available
- Heidelberg MLA150 – Maskless lithography system open for users
- Spring 2020 Newsletter
- Bosch polymer removal comparison
- Interfacial Tension (IFT) Measurement Available
- Free Full Access to the Oxford Aztec Suite.
- COVID 19 Update (April 6)
- COVID-19 Update (March 30)
- COVID-19 Update (March 23)
- COVID-19 Update (March 18)
- COVID-19 Update (March 15)
- Wet Aisle Reconfiguration
- Winter 2020 Newsletter
- Heidelberg MLA150 installation